I ka makahiki i hala, ua lilo ʻo Samsung i mea hana nui loa o nā mea semiconductor ma ka honua. Eia naʻe, manaʻo ʻo ia e hoʻomau i ka hoʻoikaika ʻana i kona kūlana, no laila makemake ʻo ia e hoʻolako i kāna mau mea hana Exynos ponoʻī i nā mea kūʻai aku o waho. Ua hakakā ka mea pilikua South Korea ma ka māhele semiconductor a hoʻokuʻu iā Intel, ka mea i paʻa i ke kūlana kiʻekiʻe no 24 mau makahiki lōʻihi, mai kahi mua i ka pae o nā mea hana nui loa o nā mea semiconductor.
Ke pōmaikaʻi nei ʻo Samsung mai ka mākeke kelepona, e ulu mau ana, ʻaʻole hiki ke ʻōlelo ʻia no ka mākeke PC, kahi e kahe ai ke kālā o Intel.
Ua hōʻike ka hui ʻo South Korea i kēia manawa e kamaʻilio me nā mea hana kelepona, ʻo ia hoʻi ka inoa Kina ZTE, e hoʻolako iā lākou me kāna mau pahu kelepona Exynos. Hāʻawi ʻo Samsung i nā chips i kahi mea kūʻai aku waho, ʻo ia ka hui Kina Meizu.
ʻO Inyup Kang, ke poʻo o Samsung System LSI, i haʻi aku iā Reuters e kūkākūkā ana kāna hui i ka hāʻawi ʻana i nā chips Exynos me nā mea hana kelepona. Eia kekahi, ua manaʻo ʻia ma ka hapa mua o ka makahiki e hiki mai ana, e hōʻike ʻo Samsung i nā hui ʻē aʻe e hāʻawi ai i nā chips mobile. Me kēia neʻe ʻana, e lilo ʻo Samsung i mea hoʻokūkū pololei iā Qualcomm.
ʻO ZTE nunui Kina, e hoʻohana ana i nā chips mai ʻAmelika Qualcomm i kāna kelepona, ua pāpā ʻia e ka US Department of Commerce mai ke kūʻai ʻana i nā ʻāpana mai nā hui ʻAmelika no ʻehiku makahiki. No laila, ʻaʻole hiki iā ZTE ke hoʻohana i nā chips Qualcomm i kāna mau kelepona no ʻehiku mau makahiki inā ʻaʻole i hāpai ʻia ka pāpā.
ʻAʻole i hoʻokō ka hui Kina ZTE i ka ʻaelike i hana ai me ke aupuni US. I ka makahiki i hala aku nei, ua ʻae ʻo ia i loko o ka ʻaha hoʻokolokolo ua uhaki ʻo ia i nā hoʻopaʻi US a kūʻai aku i nā ʻāpana US, hoʻokomo iā lākou i loko o kāna mau mea hana a hoʻouna ʻole ʻia i Iran. Pono ʻo Tech Giant ZTE i kēia manawa e hoʻololi i kāna kaulahao lako. Ua ʻōlelo ʻo Kang, e hoʻāʻo ʻo Samsung e kiʻi iā ZTE e kūʻai i nā pahu Exynos mai iā ia.
