ʻOiai ʻo Samsung kekahi o nā ʻoihana ʻenehana nui loa i ka honua, ʻoiai ʻaʻole ia e pale i ka hemahema o ka chip honua i kēia manawa. Ua hōʻike ʻia ka ʻenehana ʻenehana South Korea i kahi "kuʻikahi" me UMC (United Microelectronics Corporation) e pili ana i ka hana ʻana i nā mea ʻike kiʻi a me nā mea hoʻokele hōʻike. Pono e hana ʻia kēia mau mea me ka hoʻohana ʻana i kahi kaʻina hana 28nm.
Ua ʻōlelo ʻia ʻo Samsung e kūʻai aku i 400 mau ʻāpana o nā lako hana i ka UMC, kahi e hoʻohana ai ka hui Taiwanese e hana i nā ʻike kiʻi, nā kaʻa hoʻohui no nā mea hoʻokele hōʻike a me nā mea ʻē aʻe no ka ʻenehana ʻenehana. Hoʻolālā ʻo UMC e hana i nā wafers 27 i kēlā me kēia mahina ma kāna hale hana Nanke, me ka hoʻomaka ʻana o ka hana nui ma 2023.
Ke hoʻopaʻa inoa nei ʻo Samsung i kahi koi kiʻekiʻe no kāna mau kiʻi kiʻi, ʻoi aku hoʻi no nā sensor 50MPx, 64MPx a me 108MPx. Manaʻo ʻia ka hui e hoʻolauna koke i kahi sensor 200 MPx a ua hōʻoia ʻo ia e hana ana i kahi sensor 600 MPx i ʻoi aku ma mua o ka hiki o ka maka kanaka.
Wahi a ka ʻoihana noiʻi kūʻai aku ʻo TrendForce, ʻo ka mea hana semiconductor nui loa ma ka ʻāpana foundry i ka makahiki i hala ʻo TSMC me ka hapa o 54,1%, ʻo ka lua ʻo Samsung me ka hapa o 15,9%, a ua hoʻopau ʻia nā mea pāʻani mua ʻekolu ma kēia kahua. na Global Foundries me ka mahele o 7,7% .
Hiki paha iā ʻoe ke hoihoi
