ʻOiai ʻo Samsung ka mea mua i hoʻomaka i ka hana 3nm chips a i kekahi mau mahina ma mua o TSMC, me he mea lā ʻaʻole i kūleʻa kāna mau hana ma kēia kahua Apple lawa ka manao. Ua hōʻike ʻia ka mea pilikua Cupertino i koho iā TSMC ma mua o ka pilikua Korea no ka hana ʻana i kāna mau pahu M3 a me A17 Bionic e hiki mai ana.
Photogallery
ʻO ka Apple M3 a me A17 Bionic chips e hiki mai ana e like me ka ʻike o ka pūnaewele ʻO Nikkei ʻAsia hana ʻia me ke kaʻina hana N3E (3nm) o TSMC. Apple E mālama paha ia i ka chipset A17 Bionic no nā hiʻohiʻona iPhone ikaika loa e hoʻomaka ai i ka makahiki aʻe, ʻoiai hiki iā ia ke hoʻohana i ka chip A16 Bionic no nā mea liʻiliʻi.
Hiki paha iā ʻoe ke hoihoi
ʻOiai ʻaʻole kuleana ʻo Samsung no ka hana ʻana i nā mīkini kamepiula M1 a me M2 o Apple i kēia manawa, ua hiki ke hana i ka mea mua, a e like me ka poʻe kiaʻi mākeke chip, pili ia i ka hope. ʻOiai ua hana ʻia kēia mau ʻāpana e TSMC, aia kekahi mau mea Apple hāʻawi i nā hui ʻē aʻe, me Samsung. ʻO ka pilikua Korea, ʻoi aku ka pololei o kāna mahele Samsung Electro-Mechanics, hāʻawi kikoʻī iā FC-BGA (Flip-Chip Ball Grid Array) substrates no ka M1 a me M2 chipsets. Pono kēia mau substrate no ka hana ʻana i nā mea hana a me nā kiʻi kiʻi kiʻi me ka nui o ka hoʻohui pū ʻana.
